Enclosure for the treatment, and particularly for the etching of substrates by the reactive plasma method
US4491496A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 1984 |
| Grant date | Jan 1, 1985 |
| Priority date | — |
| Expiry date | Jan 4, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S156/914
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Enclosure for the treatment of substrates by the reactive plasma method, consisting in a known manner of an inlet and an outlet (12) for the circulation of a reactive gas at low pressure, a base supporting the substrate (10) to be treated being placed between two electrodes, one of which (3) is at the ground potential and the other (4) or radio-frequency electrode is brought to an alternative potential such as to create an electrical discharge in the enclosure. It is characterized in that the enclosure is metallic and lined by plasma torch spraying with a protective coating (2) of alumina (Al.sub.2 0.sub.3) of a thickness of about 300 micrometers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.