Philippe Laporte
3Patents
3h-index
3Co-inventors
43Inventor score
Filing activity: Jan 4, 1984 → Jul 23, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5354711A | Process for etching and depositing integrated circuit interconnections and contacts | Electricity | 98 | Expired |
| US4491496A | Enclosure for the treatment, and particularly for the etching of substrates by the reactive plasma method | Emerging Cross-Sectional Technologies | 78 | Expired |
| US6077383A | Device for separating wafers and process for using said device | Emerging Cross-Sectional Technologies | 43 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.