Process of brazing using low temperature braze alloy of gold-indium tin
US4492842A · kind A · utility
2Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 1983 |
| Grant date | Jan 8, 1985 |
| Priority date | — |
| Expiry date | Aug 8, 2003 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/3013
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A heat resistant brazing alloy of a major amount of gold, a lesser amount of indium and a minor amount of tin. The alloy is particularly suited for use in bonding electrical components to chip carrying substrates which are to be reworked.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.