Bath composition and method for copper-tin-zinc alloy electroplating
US4496438A · kind A · utility
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22Claims
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Key dates
| Filing date | Jun 24, 1983 |
| Grant date | Jan 29, 1985 |
| Priority date | — |
| Expiry date | Jun 24, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/58
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An alkaline, cyanide, aqueous electroplating composition of copper, tin, and zinc includes a small amount of nickel to enhance the inclusion of tin in the copper-tin-zinc plate deposited from the solution. The plate resists tarnishing by a corrosion test solution, and retains its bright silvery-colored appearance because the plate preferably includes at least about 10.9 atomic wt % tin. The plating method for enhanced tin alloys through nickel additions to the bath is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.