Douglas W. Trobough
6Patents
5h-index
8Co-inventors
48Inventor score
Filing activity: Jun 24, 1983 → Jun 24, 1991
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5097101A | Method of forming a conductive contact bump on a flexible substrate and a flexible substrate | Emerging Cross-Sectional Technologies | 99 | Expired |
| US4814049A | Plating bath composition for copper-tin-zinc alloy | Chemistry; Metallurgy | 28 | Expired |
| US4993958A | High density planar interconnect | Electricity | 19 | Expired |
| US5166609A | Adapter and test fixture for an integrated circuit device package | Emerging Cross-Sectional Technologies | 14 | Expired |
| US5202622A | Adapter and test fixture for an integrated circuit device package | Electricity | 13 | Expired |
| US4496438A | Bath composition and method for copper-tin-zinc alloy electroplating | Chemistry; Metallurgy | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.