Wafer handling apparatus and method
US4507078A · kind A · utility
35Cited by
4References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 1983 |
| Grant date | Mar 26, 1985 |
| Priority date | — |
| Expiry date | Mar 28, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/136
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer handling method and apparatus insures proper centering of a wafer at a work station and controls the heat transferred to the wafer in a baking operation. The amount of heat transferred and the rate at which the heat is transferred to the wafer are regulated by controlling the distance between the wafer and a hot plate. The hot plate is maintained at a constant temperature higher than the bake out or equilibrium temperature to which the wafer is to be heated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.