Machine for filling via holes in an integrated circuit package with conductive ink
US4519760A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 2, 1984 |
| Grant date | May 28, 1985 |
| Priority date | — |
| Expiry date | Apr 2, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A machine for filling a plurality of via holes in a workpiece comprises a hollow member having an open face; a masking member covering the face and having a plurality of holes which are arranged across the face such that they match the via holes in the workpiece; a diaphragm inside of the hollow member having a front surface that forms a first cavity with the masking member for receiving a high viscosity conductive ink and having a back surface that forms a second cavity with the hollow member; a means for holding the workpiece against the masking member such that their respective holes are aligned; and an orifice in the hollow member for introducing a fluid under pressure into the second cavity and against the back surface of the diaphragm to thereby squeeze a portion of the high viscosity ink through the holes of the masking member and into the holes of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.