Ronald A. Norell
16Patents
10h-index
18Co-inventors
65Inventor score
Filing activity: Apr 2, 1984 → Oct 11, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5839191A | Vibrating template method of placing solder balls on the I/O pads of an integrated circuit package | Emerging Cross-Sectional Technologies | 92 | Expired |
| US4643935A | Epoxy-glass integrated circuit package having bonding pads in a stepped cavity | Emerging Cross-Sectional Technologies | 32 | Expired |
| US4636275A | Elastic bladder method of fabricating an integrated circuit package having bonding pads in a stepped cavity | Electricity | 30 | Expired |
| US5561590A | Heat transfer sub-assembly incorporating liquid metal surrounded by a seal ring | Emerging Cross-Sectional Technologies | 28 | Expired |
| US5572404A | Heat transfer module incorporating liquid metal squeezed from a compliant body | Emerging Cross-Sectional Technologies | 22 | Expired |
| US4519760A | Machine for filling via holes in an integrated circuit package with conductive ink | Electricity | 16 | Expired |
| US5087396A | Method of forming holes in unfired ceramic layers of integrated circuit packages | Electricity | 16 | Expired |
| US5816481A | Pin block method of dispensing solder flux onto the I/O pads of an integrated circuit package | Electricity | 15 | Expired |
| US5303618A | Via hole punch | Emerging Cross-Sectional Technologies | 14 | Expired |
| US5918516A | Method of forming I/O columns with open ends that are free of crater-like voids | Emerging Cross-Sectional Technologies | 10 | Expired |
| US5454159A | Method of manufacturing I/O terminals on I/O pads | Emerging Cross-Sectional Technologies | 9 | Expired |
| US5724229A | Electromechanical assembly having a lid which protects IC chips and holds contact springs | Electricity | 7 | Expired |
| US6271048A | Process for recycling a substrate from an integrated circuit package | Electricity | 7 | Expired |
| US6105851A | Method of casting I/O columns on an electronic component with a high yield | Electricity | 6 | Expired |
| US6581486B1 | Integrated circuit tester having a fail-safe mechanism for moving IC-chips | Emerging Cross-Sectional Technologies | 3 | Expired |
| US5075765A | Low stress multichip module | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.