Patent · US Expired

Process and device for the nondestructive measurement of material accumulations or coating thicknesses on dielectric materials, in particular plastic

US4520308A · kind A · utility

13Cited by
3References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 7, 1982
Grant dateMay 28, 1985
Priority date
Expiry dateSep 7, 2002

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01B15/02
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A process and apparatus for the non-destructive measurement of the thickness of sheets or hollow bodies made of dielectric materials, such as plactis, makes use of a microwave frequency signal which is fed to an elongated microwave strip line which is placed either close to, or in contact with, the material to be measured, whereby the change in the propagation time of the signal represents the thickness, or the filling factor of the measured material. In the case of hollow bodies the strength of the signal is insufficient to be affected by the wall of the body remote from the conductor, and an advantage of the system is that it can be used to measure plastic materials while in a plastic state while in the process of extrusion.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.