Thin film thickness measurement with thermal waves
US4522510A · kind A · utility
156Cited by
15References
20Claims
0Family size
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Key dates
| Filing date | Apr 1, 1983 |
| Grant date | Jun 11, 1985 |
| Priority date | — |
| Expiry date | Apr 1, 2003 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/171
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for thin film thickness measurements with thermal waves in which heating and detection laser beams are focused onto the film, normal to the surface of the film, with the two beams parallel and non-coaxial.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.