Semiconductor packages
US4524238A · kind A · utility
53Cited by
25References
32Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 29, 1982 |
| Grant date | Jun 18, 1985 |
| Priority date | — |
| Expiry date | Dec 29, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various embodiments of a casing adapted to receive an electronic device and in particular power discrete devices are disclosed. The casings include metal or metal alloy base components with the electronic device adhered to its surface. A metal or metal alloy leadframe is bonded to and electrically insulated from the base component. The electronic device is connected to the leadframe. A metal or metal alloy cover is bonded to the leadframe to seal the electronic device within the casing. Each of the modifications includes a technique for effectively removing the heat generated by the electronic device from the casing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.