Substrate loading means for a chemical vapor deposition apparatus
US4524719A · kind A · utility
10Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 1983 |
| Grant date | Jun 25, 1985 |
| Priority date | — |
| Expiry date | Sep 6, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A controlled temperature deposition device comprising an inner reaction chamber having gas distribution means for introducing gas into inner chamber and removing gas therefrom and a vacuum chamber means surrounding the inner deposition chamber and spaced from the walls thereof for maintaining a medium vacuum therein. Associated with the deposition device is a substrate loading and unloading fork which transfers substrates such as wafer boats from outside the device to a position in the inner deposition chamber and removes them from the inner deposition chamber following deposition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.