Deposition of copper from electroless plating compositions
US4525390A · kind A · utility
15Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 1984 |
| Grant date | Jun 25, 1985 |
| Priority date | — |
| Expiry date | Mar 9, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/40
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Copper is deposited onto a substrate by plating a first layer of copper onto the substrate from an electroless plating bath and plating a second layer of copper onto the first layer of copper from a second and different electroless plating bath. The first and second plating baths differ from each other in at least the cyanide content and oxygen content. The process reduces plating void defects and reduces nodule formation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.