William J. Amelio
8Patents
6h-index
18Co-inventors
52Inventor score
Filing activity: Oct 11, 1983 → Feb 17, 1988
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4448804A | Method for selective electroless plating of copper onto a non-conductive substrate surface | Electricity | 55 | Expired |
| US4639380A | Process for preparing a substrate for subsequent electroless deposition of a metal | Electricity | 23 | Expired |
| US4525390A | Deposition of copper from electroless plating compositions | Chemistry; Metallurgy | 15 | Expired |
| US4654126A | Process for determining the plating activity of an electroless plating bath | Chemistry; Metallurgy | 12 | Expired |
| US4786528A | Process for treating reinforced polymer composite | Electricity | 9 | Expired |
| US4593016A | Process for manufacturing a concentrate of a palladium-tin colloidal catalyst | Performing Operations; Transporting | 7 | Expired |
| US4655833A | Electroless copper plating bath and improved stability | Chemistry; Metallurgy | 5 | Expired |
| US4820643A | Process for determining the activity of a palladium-tin catalyst | Physics | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.