Method for forming tapered films
US4536419A · kind A · utility
6Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1983 |
| Grant date | Aug 20, 1985 |
| Priority date | — |
| Expiry date | Mar 10, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/044
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Method for forming thin films on a substrate by using a mask through dry process wherein the substrate and the mask are moved relative to each other at least once for the formation of a thin film before the thickness of the thin film being formed on the substrate reaches a predetermined value, so that the formed thin film has an outer edge partly or entirely contoured stepwise.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.