Selective metallization process
US4537799A · kind A · utility
10Cited by
8References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 1984 |
| Grant date | Aug 27, 1985 |
| Priority date | — |
| Expiry date | Apr 16, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1415
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A selective metallization process particularly suited for making printed circuit boards comprises the step of treating a substrate having a negative mask thereon with a reactant, e.g., acetic acid, which modifies the surface of the mask without affecting the substrate so as to remove or prevent an active catalytic layer from remaining on the surface of the mask thereby preventing electroless plating on the mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.