Method of fabricating semiconductor device by dry process utilizing photochemical reaction, and apparatus therefor
US4540466A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 26, 1984 |
| Grant date | Sep 10, 1985 |
| Priority date | — |
| Expiry date | Apr 26, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/268
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Photochemical technique is applied, in a unique manner, to the so-called dry process intended for etching a substrate or for deposition thereon in the presence of a gas supplied into a chamber containing the substrate. The interior of this chamber is so structured as to produce a higher pressure gas region and a lower pressure gas region. A beam of light rays is caused to impinge onto the former region to activate the particles of gas. The resulting gas containing the activated particles is fed onto the substrate placed in the latter region as carried through at least one passageway provided between the two regions by the flow of gas caused due to the difference in pressure of gas in these two regions. Thus, the aimed etching or deposition is carried out without damaging the surface of the substrate which would occur by the collision of the otherwise heavily energized particles against the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.