Dielectric substrates comprising cordierite and method of forming the same
US4540621A · kind A · utility
Inventors
Key dates
| Filing date | Jul 29, 1983 |
| Grant date | Sep 10, 1985 |
| Priority date | — |
| Expiry date | Jul 29, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for forming a substrate for electronic applications having a dielectric constant of less than 6 is disclosed. The method comprises admixing crystalline cordierite particles having a size of 0.1--10 microns with a binder and solvent, casting the same into a sheet, drying the cast sheet into a self-supporting green sheet and then heating the green sheet to burn out the binder and to sinter the particles together. A metallization pattern is deposited on the green sheet after the casting but before the heating, the metallization pattern being molybdenum or tungsten. The cordierite has a defined coefficient of thermal expansion. A dielectric substrate for mounting of integrated circuit devices thereon is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.