Edward A. Giess
7Patents
6h-index
35Co-inventors
59Inventor score
Filing activity: Dec 31, 1975 → Jul 1, 1994
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5283104A | Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates | Emerging Cross-Sectional Technologies | 53 | Expired |
| US5337475A | Process for producing ceramic circuit structures having conductive vias | Emerging Cross-Sectional Technologies | 25 | Expired |
| US4540621A | Dielectric substrates comprising cordierite and method of forming the same | Emerging Cross-Sectional Technologies | 19 | Expired |
| US4962086A | High T.sub.c superconductor - gallate crystal structures | Emerging Cross-Sectional Technologies | 16 | Expired |
| US5545429A | Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess | Electricity | 16 | Expired |
| US4070658A | Ion implanted bubble propagation structure | Electricity | 8 | Expired |
| US5834405A | Superconducting multilayer ceramic substrate | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.