High density packages
US4542259A · kind A · utility
49Cited by
12References
47Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 19, 1984 |
| Grant date | Sep 17, 1985 |
| Priority date | — |
| Expiry date | Sep 19, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Several embodiments of high density packages which form an enclosure adapted to receive electronic devices are disclosed. Each package includes a metal lead frame having staggered leads which extend external to the package. A seal ring construction is provided so that hermetic seals are possible without subjecting the electronic devices to high temperatures. Various metals and sealing materials are advantageously used in the contruction of the devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.