Palladium plating
US4545868A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 1984 |
| Grant date | Oct 8, 1985 |
| Priority date | — |
| Expiry date | Aug 10, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/627
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a method for high speed palladium electroplating by immersing the object to be plated in an ammoniacal solution of a palladium tetra-amino complex ion, palladium metal in a concentration of at least 10 g/l, and at least one carbonate or phosphate anion in a concentration of more than about 7.5 g/l and less than about 150 g/l. The solution has a pH of between about 7 and 9 and is free of quaternized pyridinium brightening agents. Palladium is plated into a substrate with high speed plating equipment which provides sufficient agitation, and current densities of 100 ASF and above to produce lustrous crack free deposits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.