Chemical vapor deposition process
US4547404A · kind A · utility
5Cited by
7References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 1984 |
| Grant date | Oct 15, 1985 |
| Priority date | — |
| Expiry date | Oct 2, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/481
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A chemical vapor deposition device having uniformly distributed heating means substantially surrounding an inner deposition reaction chamber for providing isothermal or precisely controlled gradient temperature conditions therein, the reaction chamber being surrounded by the walls of an outer vacuum chamber spaced therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.