Method and apparatus for reducing package height for microcircuit packages
US4547624A · kind A · utility
11Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1983 |
| Grant date | Oct 15, 1985 |
| Priority date | — |
| Expiry date | Dec 2, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An offset weld ring is brazed or soldered to the top surface of a flat pack frame to provide an offset weld surface for the welding of a lid to the package in which the heat applied during the welding process is moved away from the glass feedthroughs in the package, thereby permitting closer spacing of the lid to the glass feedthrough for minimizing overall package height and obtaining a low profile package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.