Automatic plasma processing device and heat treatment device for batch treatment of workpieces
US4550242A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1982 |
| Grant date | Oct 29, 1985 |
| Priority date | — |
| Expiry date | Sep 27, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/137
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An automatic plasma processing device having a substantially vertically disposed plasma chamber in which a plurality of semiconductor wafers are processed with plasma simultaneously. The device comprises a container cassette adapted to contain a plurality of wafers therein, a feeding mechanism for feeding the cassette to a predetermined position, a replacing mechanism for taking out the wafers from the cassette placed at the predetermined position, a holding frame operable to receive the wafers from the replacing mechanism and hold the same therein, a driving mechanism for moving the holding frame up and down into and out of the plasma chamber, a plasma generating mechanism for generating plasma in the plasma chamber, and a control system for controlling the aforesaid mechanisms. The automatic plasma processing device has a simplified construction and automatically and successively processes a large number of wafers, while at the same time being compact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.