Apparatus for connecting contact pins to a substrate
US4550493A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 8, 1984 |
| Grant date | Nov 5, 1985 |
| Priority date | — |
| Expiry date | Feb 8, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53209
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A machine for forming a head and a bulge on a copper pin and to connect the pin to a ceramic substrate by a single application of impact force at high velocity and controlled energy conditions includes an air cylinder within which a piston of controlled mass moves due to the effect of compressed air stored in an accumulator. A die block includes a two dimensional array of holes into which are fitted pin blanks that extend above the surface of the die block and on which is fitted a substrate having an identical array of pin holes formed therein. The pins are fitted within the die block and on the substrate such that a predetermined length of the pin blank extends above the surface of the substrate and a controlled length of the pin blanks extends between the substrate and the die block. The pins are retained within the die against axial movement and the holes in the substrate and die block provide radial restraint to the pins following the application of the impact force. The substrate is elastically supported to deflect after impact while the pin head and bulge are forming.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.