John D. Larnerd
3Patents
3h-index
6Co-inventors
39Inventor score
Filing activity: Feb 8, 1984 → Feb 14, 1991
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5166037A | Method of additive circuitization of circuit boards with high adhesion, voidless copper leads | Electricity | 18 | Expired |
| US4550493A | Apparatus for connecting contact pins to a substrate | Emerging Cross-Sectional Technologies | 17 | Expired |
| US4676426A | Solder leveling technique | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.