Four-motion wire bonder
US4550871A · kind A · utility
20Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 1982 |
| Grant date | Nov 5, 1985 |
| Priority date | — |
| Expiry date | Aug 24, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A four-motion wire bonding apparatus, for effecting wire bonds between a semiconductor chip and a lead frame. In addition to employing X-, Y-, Z- and theta-motion drives for the bonding head, the apparatus provides a bulk wire-feed, which delivers bonding wire along the theta-rotation axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.