ASM Assembly Automation Ltd
125Patents
67Active
125Granted
52Portfolio score
Filing activity: Aug 24, 1982 → Mar 28, 2011 · 57 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7854365B2 | Direct die attach utilizing heated bond head | Electricity | 94 | Active |
| US4603803A | Wire bonding apparatus | Electricity | 49 | Expired |
| US7002283B2 | Ultrasonic transducer assembly | Electricity | 45 | Expired |
| US6616031B2 | Apparatus and method for bond force control | Performing Operations; Transporting | 38 | Expired |
| US7808133B1 | Dual-axis planar motor providing force constant and thermal stability | Electricity | 33 | Active |
| US6367669B1 | Fluid dispensing apparatus | Physics | 32 | Expired |
| US6386422B1 | Solder reflow oven | Performing Operations; Transporting | 29 | Expired |
| US7757742B2 | Vibration-induced die detachment system | Emerging Cross-Sectional Technologies | 27 | Active |
| US6967492B2 | Spring contact probe device for electrical testing | Physics | 24 | Expired |
| US4550871A | Four-motion wire bonder | Electricity | 20 | Expired |
| US4606490A | Apparatus and method for automatic evaluation of a bond created by an ultrasonic transducer | Performing Operations; Transporting | 19 | Expired |
| US6806725B2 | Method and apparatus for processing an array of packaged semiconductor devices | Electricity | 17 | Expired |
| US6543513B1 | Wafer table for die bonding apparatus | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6279810A | Piezoelectric sensor for measuring bonding parameters | Electricity | 16 | Expired |
| US7145162B2 | Wire loop height measurement apparatus and method | Electricity | 15 | Expired |
| US6758113B2 | High speed pick and place apparatus | Emerging Cross-Sectional Technologies | 14 | Expired |
| US7240422B2 | Apparatus for semiconductor chip detachment | Emerging Cross-Sectional Technologies | 13 | Expired |
| US7182118B2 | Pick and place assembly for transporting a film of material | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6709877B2 | Apparatus and method for testing semiconductor devices | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6813225B2 | Linear motor driven mechanism using flexure bearings for opto-mechanical devices | Physics | 13 | Expired |
| US5897048A | Radial wire bonder and selectable side view inspection system | Electricity | 12 | Expired |
| US8056827B2 | Jet dispenser comprising magnetostrictive actuator | Electricity | 11 | Active |
| US6766938B2 | Apparatus and method of placing solder balls onto a substrate | Electricity | 11 | Expired |
| US8470130B2 | Universal die detachment apparatus | Emerging Cross-Sectional Technologies | 10 | Active |
| US7665204B2 | Die detachment apparatus comprising pre-peeling structure | Emerging Cross-Sectional Technologies | 10 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.