Dendritic treatment of metallic surfaces for improving adhesive bonding
US4551210A · kind A · utility
13Cited by
16References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 13, 1984 |
| Grant date | Nov 5, 1985 |
| Priority date | — |
| Expiry date | Nov 13, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a treatment for improving the laminate adhesion of metal and metal alloy materials, particularly copper and copper alloy foils. The treatment comprises electrolytically forming a plurality of dendrites on a surface of the metal or metal alloy material and bonding the dendrites thereto. The dendrites are formed on and bonded to the metal or metal alloy material surface by one or more treatment anodes positioned at an angle to the material being treated and a single current source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.