Arvind Parthasarathi
34Patents
14h-index
37Co-inventors
81Inventor score
Filing activity: Nov 13, 1984 → Sep 7, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5650663A | Electronic package with improved thermal properties | Electricity | 246 | Expired |
| US5578869A | Components for housing an integrated circuit device | Electricity | 197 | Expired |
| US4997517A | Multi-metal layer interconnect tape for tape automated bonding | Emerging Cross-Sectional Technologies | 64 | Expired |
| US5343073A | Lead frames having a chromium and zinc alloy coating | Electricity | 40 | Expired |
| US4749626A | Whisker resistant tin coatings and baths and methods for making such coatings | Emerging Cross-Sectional Technologies | 39 | Expired |
| US5449951A | Lead frames with improved adhesion to a polymer | Electricity | 33 | Expired |
| US4568431A | Process for producing electroplated and/or treated metal foil | Emerging Cross-Sectional Technologies | 29 | Expired |
| US5688606A | Anodized aluminum substrate having increased breakdown voltage | Emerging Cross-Sectional Technologies | 29 | Expired |
| US5534356A | Anodized aluminum substrate having increased breakdown voltage | Emerging Cross-Sectional Technologies | 26 | Expired |
| US6136460A | Tin coatings incorporating selected elemental additions to reduce discoloration | Emerging Cross-Sectional Technologies | 19 | Expired |
| US4647315A | Copper stainproofing technique | Electricity | 18 | Expired |
| US10404748B2 | Cyber risk analysis and remediation using network monitored sensors and methods of use | Electricity | 16 | Active |
| US5817544A | Enhanced wire-bondable leadframe | Electricity | 15 | Expired |
| US5540378A | Method for the assembly of an electronic package | Emerging Cross-Sectional Technologies | 14 | Expired |
| US5969414A | Semiconductor package with molded plastic body | Electricity | 13 | Expired |
| US4551210A | Dendritic treatment of metallic surfaces for improving adhesive bonding | Electricity | 13 | Expired |
| US6083633A | Multi-layer diffusion barrier for a tin coated electrical connector | Emerging Cross-Sectional Technologies | 12 | Expired |
| US4549950A | Systems for producing electroplated and/or treated metal foil | Electricity | 12 | Expired |
| US5234536A | Process for the manufacture of an interconnect circuit | Electricity | 10 | Expired |
| US5563442A | Leadframe having exposed, solderable outer lead ends | Emerging Cross-Sectional Technologies | 9 | Expired |
| US4692221A | In-situ dendritic treatment of electrodeposited foil | Electricity | 8 | Expired |
| US4552627A | Preparation for improving the adhesion properties of metal foils | Emerging Cross-Sectional Technologies | 7 | Expired |
| US5952083A | Aluminum alloys for electronic components | Emerging Cross-Sectional Technologies | 7 | Expired |
| US5573845A | Superficial coating layer having acicular structures for electrical conductors | Emerging Cross-Sectional Technologies | 7 | Expired |
| US4549941A | Electrochemical surface preparation for improving the adhesive properties of metallic surfaces | Emerging Cross-Sectional Technologies | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.