Preparation for improving the adhesion properties of metal foils
US4552627A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 13, 1984 |
| Grant date | Nov 12, 1985 |
| Priority date | — |
| Expiry date | Nov 13, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12472
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a technique for improving the adhesive properties of a metal or metal alloy material by reducing the number of bare spots and unplated regions on each treated surface of the metal or metal alloy material. The technique comprises electrolytically forming a substantially uniform metal oxide layer on at least one surface of the material, chemically converting the oxide layer into a substantially uniform layer of fresh metal, and thereafter electrolytically forming a plurality of dendritic structures on the at least one surface. The technique of the present invention has particular utility in improving the adhesive properties of wrought copper and copper alloy foils. An apparatus for performing the technique is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.