Tin-lead alloy plating bath
US4555314A · kind A · utility
1Cited by
1References
6Claims
0Family size
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Key dates
| Filing date | Sep 10, 1984 |
| Grant date | Nov 26, 1985 |
| Priority date | — |
| Expiry date | Sep 10, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A tin-lead alloy plating bath based on a principal plating bath comprising an alkanesulfonic or alkanolsulfonic acid and both bivalent tin and lead salts thereof is characterized by the addition of a guanamine compound having the general formula ##STR1## wherein R.sub.1 and R.sub.2, which may be the same or different, represent each a hydrogen atom, C.sub.1-18 straight- or branched-chain alkyl radical, C.sub.1-18 straight- or branched-chain alkoxy-lower alkyl radical, or a C.sub.3-7 cycloalkyl radical, or R.sub.1 and R.sub.2 may combine to form a carbon cycle or hetero cycle, and A represents a lower alkylene radical.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.