Epoxy resin composition
US4555532A · kind A · utility
8Cited by
2References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 1984 |
| Grant date | Nov 26, 1985 |
| Priority date | — |
| Expiry date | Oct 10, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0209
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An epoxy resin composition containing as a latent hardener a diaminotriazine-modified imidazole compound and dicyandiamide is improved in the usable life of an solder resist ink composition and can give a solder resist also excellent in resistance to an electroless plating bath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.