Process for electro-magnetic interference shielding
US4556587A · kind A · utility
5Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 1983 |
| Grant date | Dec 3, 1985 |
| Priority date | — |
| Expiry date | Dec 19, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/28
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for metal plating plastic or elastomeric materials which produces a coating of high conductivity which does not reduce over time is disclosed in this application to provide electro-magnetic interference shielding for said materials. This process uses either a particular special plating bath containing stabilizer additions with any surface preparation technique, or a certain specific surface preparation technique along with the use of a standard plating bath or the special stabilized plating bath to obtain metal coatings with the desired properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.