Electroless copper plating solution
US4563217A · kind A · utility
16Cited by
5References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 1984 |
| Grant date | Jan 7, 1986 |
| Priority date | — |
| Expiry date | Jun 22, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/40
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless copper plating solution comprising cupric ions, complexing agents, a reducing agent, a pH adjustor, a polyoxyethylene series surface active agent, these being conventionally used, and (i) an inorganic compound containing at least Si or Ge, or (ii) a cationic surface active agent, or (iii) an inorganic compound containing at least Si, Ge or V and a cationic surface active agent, can give plated films with excellent mechanical properties even if operated for a long period of time with excellent stability of the plating solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.