Process for the deposition of palladium-nickel alloy
US4564426A · kind A · utility
3Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 1985 |
| Grant date | Jan 14, 1986 |
| Priority date | — |
| Expiry date | Apr 15, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/567
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A palladium-nickel alloy is deposited onto a substrate by electroplating from a plating bath containing palladosammine chloride, nickel ion source, ammonium sulfate, ammonium chloride, and sufficient ammonium hydroxide to provide a pH of about 7.0 to about 8.3 at a temperature of about 60.degree. F. to about 90.degree. F.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.