Robert D. Topa
10Patents
5h-index
15Co-inventors
59Inventor score
Filing activity: Apr 15, 1985 → Jun 15, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5237743A | Method of forming a conductive end portion on a flexible circuit member | Emerging Cross-Sectional Technologies | 52 | Expired |
| US5135155A | Thermocompression bonding in integrated circuit packaging | Electricity | 25 | Expired |
| US5006917A | Thermocompression bonding in integrated circuit packaging | Electricity | 21 | Expired |
| US6626196B2 | Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing | Emerging Cross-Sectional Technologies | 10 | Expired |
| US5242569A | Thermocompression bonding in integrated circuit packaging | Electricity | 7 | Expired |
| US6179990A | Biased acid cleaning of a copper-invar-copper laminate | Electricity | 4 | Expired |
| US5148261A | Thermocompression bonding in integrated circuit packaging | Emerging Cross-Sectional Technologies | 3 | Expired |
| US4564426A | Process for the deposition of palladium-nickel alloy | Chemistry; Metallurgy | 3 | Expired |
| US6228246A | Removal of metal skin from a copper-Invar-copper laminate | Electricity | 3 | Expired |
| US5120418A | Lead frame plating apparatus for thermocompression bonding | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.