Apparatus for testing integrated circuits
US4567432A · kind A · utility
74Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 1983 |
| Grant date | Jan 28, 1986 |
| Priority date | — |
| Expiry date | Jun 9, 2003 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2891
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for statically and dynamically testing an integrated circuit die in wafer form at various temperatures includes a multilayer support fixture in which the probes, the static test switching circuitry, and the dynamic test switching circuitry are mounted on separate, spaced apart, planar layers detachably connected to one another, the probe and the probe support board being formed of materials having a low temperature coefficient of thermal expansion. A heated/cooled wafer positioning chuck controls the temperature of the wafer thereon during static and dynamic testing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.