Hermetically sealed metal package
US4577056A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 9, 1984 |
| Grant date | Mar 18, 1986 |
| Priority date | — |
| Expiry date | Apr 9, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to a hermetically sealed package adapted to form an enclosure for a semiconductor device. The package comprises a substrate with a refractory oxide layer on one surface and a metallized band on the refractory oxide layer. A metal cover is disposed on the substrate and sealed to the metallized band. A lead frame disposed between the substrate and cover comprises a plurality of lead elements which extend into the enclosure to be electrically connected to the semiconductor device. The lead frame has a refractory oxide layer on its surface to electrically insulate the lead frame from both the substrate and the cover. The lead frame also has a metallized band on its refractory oxide layer. A solder component bonds the cover onto the substrate with the lead frame extending therebetween so that the electronic device is sealed within the closure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.