Method for mounting a semiconductor chip
US4577398A · kind A · utility
19Cited by
7References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 7, 1984 |
| Grant date | Mar 25, 1986 |
| Priority date | — |
| Expiry date | Sep 7, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of attaching a semiconductor chip to a mounting surface is disclosed. A solder barrier is applied to the mounting surface, and a preform of solder is located within the solder barrier. The preform is heated and then cooled in a vacuum to preflow the solder and secure the solder to the mounting surface substantially without voids. The semiconductor chip is then placed over the preflowed solder, which is reheated and then recooled in a vacuum to secure the chip to the mounting surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.