John MacKay
13Patents
7h-index
10Co-inventors
63Inventor score
Filing activity: Sep 7, 1984 → May 12, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6293456A | Methods for forming solder balls on substrates | Electricity | 23 | Expired |
| US6126059A | Captured-cell solder printing and reflow methods and apparatuses | Electricity | 21 | Expired |
| US5988487A | Captured-cell solder printing and reflow methods | Electricity | 21 | Expired |
| US4577398A | Method for mounting a semiconductor chip | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6609652B2 | Ball bumping substrates, particuarly wafers | Electricity | 13 | Expired |
| US7007833B2 | Forming solder balls on substrates | Electricity | 9 | Expired |
| US7604153B2 | Forming solder balls on substrates | Electricity | 7 | Active |
| US7837083B2 | Forming solder balls on substrates | Electricity | 4 | Active |
| US7654432B2 | Forming solder balls on substrates | Electricity | 4 | Active |
| US8446319B2 | Electronic tracking system | Mechanical Engineering; Lighting; Heating | 3 | Active |
| US7288471B2 | Bumping electronic components using transfer substrates | Emerging Cross-Sectional Technologies | 1 | Expired |
| US7842599B2 | Bumping electronic components using transfer substrates | Electricity | 1 | Active |
| US7819301B2 | Bumping electronic components using transfer substrates | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.