Circuit chip
US4582975A · kind A · utility
19Cited by
4References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 10, 1984 |
| Grant date | Apr 15, 1986 |
| Priority date | — |
| Expiry date | Dec 10, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3494
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method for removing a hybrid or integrated circuit chip soldered to a support structure. An electrical energy source is applied to the hybrid circuit chip for raising the temperature of the circuit chip sufficiently so as to melt the solderable material which interconnects the chip to the support structure. When the solderable material is melted, the circuit chip may then be removed from the support structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.