Method of forming an electrically conductive member
US4586988A · kind A · utility
97Cited by
10References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 1983 |
| Grant date | May 6, 1986 |
| Priority date | — |
| Expiry date | Aug 19, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of depositing a preselected pattern of electrically conductive metallic material onto a layer of relatively transparent electrically conductive material. In its broadest form the method includes the single step of electroplating the electrically conductive metallic material onto the transparent conductive layer. The method has particular utility in electroplating metal grid patterns onto the indium tin oxide layer of an amorphous thin film photovoltaic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.