Automatic wafer prober having a probe scrub routine
US4590422A · kind A · utility
59Cited by
1References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 30, 1981 |
| Grant date | May 20, 1986 |
| Priority date | — |
| Expiry date | Jul 30, 2001 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07314
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In an automatic wafer prober, the prober steps through a certain predetermined sequence of die on the wafer. After a certain predetermined number of die have been probed, the prober automatically interrupts the probing sequence and steps the prober off of the wafer onto an abrasive element for scrubbing clean the probe tips. Thereafter, the prober returns to its predetermined probing sequence. The abrasive element is preferably fixidly secured to the wafer chuck. A flat of the abrasive element serves as an alignment flat for registration with a flat of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.