Substrate having at least one fine-wired conductive layer
US4594473A · kind A · utility
12Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 1984 |
| Grant date | Jun 10, 1986 |
| Priority date | — |
| Expiry date | Mar 9, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/901
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A fine-wired conductor for use in LSI circuits exhibits good adhesion properties. The conductor is made up of a film of metal such as chrome or titanium on an insulator such as a ceramic substrate, a gold layer over the film of metal and a palladium film on the gold layer. In addition, a palladium layer can be interposed between the metal film and the gold layer to facilitate gold plating and inhibit diffusion of the metal and the gold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.