Mitsuru Kimura
11Patents
6h-index
11Co-inventors
59Inventor score
Filing activity: Mar 9, 1984 → Aug 13, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4874721A | Method of manufacturing a multichip package with increased adhesive strength | Emerging Cross-Sectional Technologies | 61 | Expired |
| US5545281A | Method of bonding circuit boards | Emerging Cross-Sectional Technologies | 35 | Expired |
| US5318651A | Method of bonding circuit boards | Emerging Cross-Sectional Technologies | 29 | Expired |
| US5576518A | Via-structure of a multilayer interconnection ceramic substrate | Electricity | 18 | Expired |
| US5714112A | Process for producing a silica sintered product for a multi-layer wiring substrate | Electricity | 15 | Expired |
| US4594473A | Substrate having at least one fine-wired conductive layer | Emerging Cross-Sectional Technologies | 12 | Expired |
| US5506058A | Mutlilayer glass ceramic substrate and method of fabricating the same | Emerging Cross-Sectional Technologies | 5 | Expired |
| US5485352A | Element joining pad for semiconductor device mounting board | Electricity | 4 | Expired |
| US6746490B2 | Winding method and structure for stator coils | Emerging Cross-Sectional Technologies | 3 | Expired |
| US5728470A | Multi-layer wiring substrate, and process for producing the same | Electricity | 2 | Expired |
| US5757062A | Ceramic substrate for semiconductor device | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.