Method of making semiconductor casing
US4594770A · kind A · utility
51Cited by
14References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 9, 1984 |
| Grant date | Jun 17, 1986 |
| Priority date | — |
| Expiry date | Aug 9, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A casing for an electrical component comprises a metal lead frame having the electrical component connected thereto. A metal base member is bonded to one surface of the lead frame. A plastic housing member is bonded to a second surface of the lead frame. An adhesive seals and bonds the metal base member and plastic housing member to the lead frame so as to enclose the electrical component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.