Method and apparatus for heating semiconductor wafers
US4597736A · kind A · utility
18Cited by
4References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 3, 1985 |
| Grant date | Jul 1, 1986 |
| Priority date | — |
| Expiry date | May 3, 2005 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27B5/04
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for heating semiconductor wafers characterized by the release of preheated nitrogen into an oven to considerably reduce heating time for the wafers. The oven is evacuated prior to the release of the preheated nitrogen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.