Method and composition for electroless nickel deposition
US4600609A · kind A · utility
28Cited by
7References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 1985 |
| Grant date | Jul 15, 1986 |
| Priority date | — |
| Expiry date | May 3, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/936
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless nickel plating method and composition is disclosed wherein a soluble acetylenic compound is included within the plating bath in small amounts effective to improve the specularity of the nickel deposit without substantially decreasing the electroless plating rate of the bath. The method and compositions of the invention are useful in producing mirror-bright electroless nickel coatings free of haze.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.