MacDermid, Incorporated
138Patents
2Active
138Granted
48Portfolio score
Filing activity: Dec 14, 1973 → Dec 17, 2021
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5235139A | Method for fabricating printed circuits | Emerging Cross-Sectional Technologies | 295 | Expired |
| US4265943A | Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions | Chemistry; Metallurgy | 278 | Expired |
| US5147692A | Electroless plating of nickel onto surfaces such as copper or fused tungston | Electricity | 256 | Expired |
| US5869130A | Process for improving the adhesion of polymeric materials to metal surfaces | Electricity | 89 | Expired |
| US5641608A | Direct imaging process for forming resist pattern on a surface and use thereof in fabricating printing plates | Emerging Cross-Sectional Technologies | 75 | Expired |
| US4409037A | Adhesion promoter for printed circuits | Electricity | 50 | Expired |
| US5160579A | Process for manufacturing printed circuit employing selective provision of solderable coating | Emerging Cross-Sectional Technologies | 50 | Expired |
| US4976990A | Process for metallizing non-conductive substrates | Electricity | 43 | Expired |
| US5747098A | Process for the manufacture of printed circuit boards | Emerging Cross-Sectional Technologies | 41 | Expired |
| US4944851A | Electrolytic method for regenerating tin or tin-lead alloy stripping compositions | Chemistry; Metallurgy | 39 | Expired |
| US4863758A | Catalyst solutions for activating non-conductive substrates and electroless plating process | Electricity | 38 | Expired |
| US4844981A | Adhesion promoter for printed circuits | Emerging Cross-Sectional Technologies | 36 | Expired |
| US6281090A | Method for the manufacture of printed circuit boards with plated resistors | Electricity | 34 | Expired |
| US4775444A | Process for fabricating multilayer circuit boards | Electricity | 34 | Expired |
| US4804615A | Method for manufacture of printed circuit boards | Electricity | 33 | Expired |
| US5733599A | Method for enhancing the solderability of a surface | Electricity | 33 | Expired |
| US4931148A | Method for manufacture of printed circuit boards | Emerging Cross-Sectional Technologies | 32 | Expired |
| US5017267A | Composition and method for stripping tin or tin-lead alloy from copper surfaces | Electricity | 32 | Expired |
| US4608275A | Oxidizing accelerator | Chemistry; Metallurgy | 31 | Expired |
| US4209331A | Electroless copper composition solution using a hypophosphite reducing agent | Chemistry; Metallurgy | 29 | Expired |
| US4600609A | Method and composition for electroless nickel deposition | Emerging Cross-Sectional Technologies | 28 | Expired |
| US4279948A | Electroless copper deposition solution using a hypophosphite reducing agent | Chemistry; Metallurgy | 28 | Expired |
| US4603058A | Post-treatment of cured, radiation sensitive, polymerizable resins to eliminate surface tack | Emerging Cross-Sectional Technologies | 27 | Expired |
| US5935640A | Method for enhancing the solderability of a surface | Electricity | 27 | Expired |
| US5965460A | Polyurethane composition with (meth)acrylate end groups useful in the manufacture of polishing pads | Chemistry; Metallurgy | 27 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.